Semiconductor Staffing Solutions

Backed by over $300B in private sector investment and CHIPS Act incentives, the U.S. semiconductor sector is undergoing a historic transformation. But as fabrication plants, equipment makers, and integrated device manufacturers scale rapidly, the real challenge remains—access to skilled engineering talent and a resilient supply chain.

From fabless design firms to full-scale foundries and their suppliers, companies need strategic workforce partners to navigate talent shortages, de-risk operations, and accelerate innovation.

Your Workforce Partner in Semiconductor Growth

We help semiconductor leaders:

  • Close critical engineering and technical skill gaps

  • Enhance supply chain continuity and operational readiness

  • Capitalize on CHIPS Act opportunities with workforce agility

Semiconductor Excellence

Why Partner With Pacer?

Pacer is a trusted workforce partner with deep expertise in sourcing top-tier engineering and technical talent across electrical, mechanical, systems, software, and manufacturing disciplines.

With over 17 years of proven staffing success, we support some of the nation’s most advanced industrial, high-tech, and semiconductor clients—delivering flexible, scalable, and high-performance workforce solutions that align with your mission-critical goals.

 

A Premier Source of Semiconductor Talent:

Pacer is building the future of semiconductor staffing with:

  • A national network of pre-vetted engineers and technicians, ready to deploy across fabs, R&D centers, and supply chain partners

  • Strong capabilities in high-volume workforce builds, niche skill placements, and project-based technical staffing

  • Dedicated recruiting teams specializing in hard-to-find skillsets and rapid response sourcing

  • Proven systems for screening, onboarding, retention, and workforce quality management

Our experienced account leads and candidate care teams ensure you get precision-matched talent, speed-to-market, and measurable results—without compromise.

 

Industry-Ready, Certified Talent

Our talent pool includes professionals with credentials such as:

  • PMP-Certified Project Managers

  • Certified CAD Designers

  • GD&T Technologists

  • Functional Safety Engineers (ISO 26262)

  • AGILE Scrum Masters

When it comes to delivering engineering excellence at scale, no one is more agile, aligned, or committed than Pacer.

Semiconductor Talent We Supply

Systems and Software Engineering
Systems Engineering
  • FPGA & ASIC Design
  • Machine Learning and Machine Vision
Embedded Systems Development
  • Firmware Design and Development
  • Hardware Design and Development
  • Product Planning and Design Life Cycle Management
  • C++ Embedded Control
Full-Stack Software Development
  • Devops
  • Continuous Integration/Continuous Deployment
Value Engineering
  • Obsolescence/End of Life Engineering
Product Supply Chain Management
Verification and Validation
Manufacturing/Lab Services
  • Equipment, Process, Metrology, Engineering, Manufacturing and Maintenance Technicians and Engineers
  • Quality Services
  • Validation
  • Testing Services
  • Plant Engineering
  • Manufacturing and Industrial Engineering
  • Controls and Automation Engineering
Mechanical and Electrical Engineering
  • Mechanical Systems Development
  • Electrical Systems Development
  • Electromechanical Engineering
  • Product Sustenance
  • Obsolescence Engineering
Project Management
  • Mechanical Systems Development
  • Electrical Systems Development
  • Electromechanical Engineering
  • Product Sustenance
  • Obsolescence Engineering

Pacer’s Global Reach

Pacer delivers agile, scalable, and customizable workforce solutions designed to align with each client’s unique objectives—from high-volume hiring to niche technical placements.

With a presence across 14 U.S. locations, active operations in 20 countries, and access to talent pipelines spanning North America, India, and Europe, we offer flexible delivery models tailored to your environment:

  • On-site & Off-site Support

  • Near-shore & Off-shore Talent Delivery

  • Remote & Hybrid Workforce Solutions

Whether you need engineers on the fab floor, technicians on a retrofit site, or remote specialists working across time zones, Pacer is built to meet demand—anywhere, anytime.

U.S. Semiconductor Industry Trends

*Based on BLS & Semiconductor Industry Association Data

Semiconductor FAQs

What’s driving semiconductor growth?

These are some of the main factors driving growth in the semiconductor industry:

  • Digitalization, electrification and technological advancements like AI and automation.
  • A need to re-shore advanced chip manufacturing to improve supply chain resiliency.
  • Nearly $450 billion in private investment.
  • $52.7 billion in federal CHIPS Act Funding.
What are the most in demand skill sets in the semiconductor industry?

The following are among the most in-demand skill sets across the semiconductor industry:

  • Software developer/engineer
  • Application developer/engineer
  • Manufacturing process engineer
  • Industrial engineer
  • Electrical engineer
The U.S. semiconductor industry will have to address the following challenges as it looks to re-shore chip manufacturing:

The U.S. semiconductor industry will have to address the following challenges as it looks to re-shore chip manufacturing:

  • Talent shortages
  • Both implementing manufacturing processes and the cost of manufacturing
  • Standardization of materials, processes, and equipment
  • Supply chain integrity
  • Advanced packaging
  • Microelectronics manufacturing
  • Improving tools for modeling and simulating semiconductor materials
What are the key processes in semiconductor manufacturing?

These are the key steps in the semiconductor manufacturing process:

  • Deposition: thin films of conducting, isolating, or semiconducting materials are deposited on the surface of a silicon wafer.
  • Photoresist coating: wafers are coated in materials that chemically react to light.
  • Lithography: ultraviolet light is used to transfer patterns onto a wafer.
  • Etching: degraded photoresist coating materials are removed from the wafer, leaving only the pattern.
  • Ion implantation: positive or negative ions are implanted into the wafer’s silicon crystals to control the flow of electricity.
  • Packaging: the process of cutting and packaging chips after they have been fabricated on a wafer.